Shin-Etsu X-23-8033-1 Thermal Grease 1kg – High-Performance Silicone Compound for Heat Sink Interface and Power Electronics Cooling Original Product

About Shin-Etsu X-23-8033-1 

Overview

• Type: Thermal Interface Grease

• Form: One-component

• Color: White

• Density @ 23°C: 3.48 g/cm³

• Viscosity: 70 Pa·s

• Thermal Conductivity: 4.0 W/m·K

• Thermal Resistance: 10 mm²·K/W

• Bond Line Thickness: 32 µm

• Dielectric Strength: 10.0 kV/mm

• Volatile Content: 0.93%

• Usable Temperature Range: -40°C to +200°C

• Low Molecular Weight Siloxane Stripped: Yes 

Key Features

• Superior Thermal Conductivity: Ensures efficient heat transfer from components to heat sinks.

• Solvent-Diluted for Ease of Application: Facilitates easy spreading; solvent evaporates after application.

• Low Volatile Content: Minimizes outgassing, suitable for sensitive electronic environments.

• Wide Operating Temperature Range: Maintains performance from -40°C to +200°C.

• Low Molecular Weight Siloxane Stripped: Reduces potential for contamination in electronic assemblies. 

Typical Applications

• CPUs and MPUs: Enhances heat dissipation in high-performance processors.

• Semiconductor Devices: Improves thermal management in power electronics.

• Heat Sinks: Facilitates efficient thermal transfer in various electronic assemblies. 

Usage Instructions

1. Surface Preparation: Ensure surfaces are clean and free from contaminants.

2. Application: Apply a thin, even layer of X-23-8033-1 to the component surface.

3. Assembly: Join the component with the heat sink, applying uniform pressure to spread the grease.

4. Curing: Allow the solvent to evaporate naturally; no additional curing is required.

Safety & Handling

• Ventilation: Use in well-ventilated areas to prevent inhalation of vapors.

• Personal Protective Equipment: Wear appropriate gloves and eye protection during application.

• Storage: Store in a cool, dry place away from direct sunlight.

• Disposal: Dispose of in accordance with local regulations.