Shin-Etsu X-23-7868-2D 1kg Thermal Grease – High-Conductivity Silicone Compound for Power Module and CPU/GPU Heat Transfer Applications Original Product

About Shin-Etsu X-23-7868-2D

Overview

Shin-Etsu X-23-7868-2D is a high-performance, solvent-diluted thermal interface material (TIM) designed to enhance heat dissipation in electronic devices. It is particularly suitable for applications requiring efficient thermal management, such as CPUs, MPUs, and semiconductor components.

• Type: Solvent-diluted thermal grease

• Color: Gray

• Viscosity:

  • Pre-application: 100 Pa·s

  • Post-application: 680 Pa·s

• Thermal Conductivity:

  • With solvent: 3.5 W/m·K

  • After solvent evaporation: 6.2 W/m·K

• Thermal Resistance: Approximately 5.0 mm²·K/W

• Specific Gravity: 2.6

• Volatile Content: 2.8% after 24 hours at 150°C

• Operating Temperature Range: -50°C to +120°C

• Bond Line Thickness: Approximately 30 µm under 20 psi pressure

Key Features

• High Thermal Conductivity: Ensures efficient heat transfer from components to heat sinks.

• Low Viscosity During Application: Facilitates easy application through dispensing, stencil printing, or screen printing methods.

• Stable Homogeneous Mixture: Provides consistent thermal performance across applications.

• RoHS and REACH Compliant: Meets environmental and safety standards.

Typical Applications

• CPUs and MPUs: Enhances thermal management in high-performance processors.

• Semiconductor Devices: Improves heat dissipation in various semiconductor components.

• LED Modules: Assists in maintaining optimal operating temperatures for LEDs.

• Automotive Electronics: Suitable for thermal management in automotive electronic systems.

Application Guidelines

1. Surface Preparation: Ensure that all surfaces are clean and free from contaminants.

2. Application: Apply a uniform layer of X-23-7868-2D to the component surface.

3. Assembly: Mount the heat sink or mating surface promptly to allow the solvent to evaporate, resulting in optimal thermal conductivity.

4. Curing: Allow the assembly to sit at room temperature or operate under normal conditions to facilitate solvent evaporation.

Safety & Handling

• Storage Conditions: Store between 60°F to 85°F (15°C to 29°C) in a well-ventilated area.

• Handling Precautions: Use appropriate personal protective equipment to avoid skin and eye contact.

• Disposal: Dispose of in accordance with local, regional, and national regulations.