Shin‑Etsu KBM‑603 Silane Coupling Agent 1 kg Ethylenediamine Functional Silane for Resin–Inorganic Adhesion

About Shin-Etsu KBM-603 Silane Coupling Agent

OVERVIEW:

Shin-Etsu KBM-603 is an organofunctional silane coupling agent designed to enhance adhesion between organic polymers and inorganic surfaces. It features an epoxy functional group, enabling chemical bonding with a wide range of resin systems while the silane portion forms durable bonds with substrates such as glass, metal, ceramics, and mineral fillers. KBM-603 is commonly used to improve bonding strength, water resistance, and durability in coatings, adhesives, sealants, and composite materials.

KEY FEATURES:

Adhesion Enhancement
Promotes strong chemical bonding between organic and inorganic materials, supporting improved mechanical properties and long-term durability.

Epoxy Functional Group
Facilitates compatibility with various resin systems, including epoxies, polyesters, acrylics, and phenolics.

Water and Moisture Resistance
Forms hydrolysis-resistant siloxane bonds with inorganic surfaces, contributing to enhanced moisture resistance of the bonded interface.

Versatile Application
Usable as a coupling agent, adhesion promoter, or surface treatment across a broad range of industries.

Improved Processing and Performance
Helps reduce interfacial stress and improves wetting of substrates, contributing to more uniform and reliable adhesion.

APPLICATIONS:

• Adhesives and Sealants – Enhances bonding performance to inorganic substrates in structural adhesives and high-performance sealants.

• Coatings and Paints – Used to improve adhesion to metal, glass, and mineral surfaces, supporting better coating durability and resistance.

• Composite Materials – Promotes bonding between resin matrices and reinforcements or fillers, improving mechanical strength.

• Glass Fiber Treatment – Applied to glass fibers to improve compatibility with resin matrices in composites.

• Electronics and Electrical – Used in encapsulants and coatings to improve adhesion and reduce moisture ingress in electronic assemblies.

PACKAGING:

Shin-Etsu KBM-603 is typically supplied in sealed containers such as 1kg bottles, 15kg pails, or 200kg drums, depending on region and distributor availability.

INSTRUCTIONS FOR USE:

• Surface Preparation: Clean substrate surfaces to remove contaminants such as oil, dust, or oxidation to ensure optimal bonding.

• Application: Apply KBM-603 as a primer, surface treatment, or formulation additive. Dilution with appropriate solvents may be required depending on process needs.

• Curing: Allow sufficient time for hydrolysis and condensation reactions to occur, ensuring durable bonding before applying subsequent layers or assembly.

SAFETY AND HANDLING:

Shin-Etsu KBM-603 should be used in well-ventilated areas. Avoid direct contact with eyes and skin. Use suitable protective equipment such as gloves and safety goggles. For full safety, handling, and disposal information, refer to the product’s Safety Data Sheet (SDS).

DISCLAIMER:

The information provided is intended for general reference only. Product performance depends on specific application conditions and materials used. Users should consult the official technical datasheet and SDS to verify suitability and ensure correct usage for their intended application.