Shin‑Etsu X‑23‑7868‑2D Thermal Grease 1 kg High‑Conductivity Silicone Compound for Power Module & CPU/GPU Heat Transfer

About Shin-Etsu X-23-7868 Thermal Grease

OVERVIEW:

Shin-Etsu X-23-7868 is a high-performance thermal interface material (TIM) formulated as a silicone-based thermal grease. It is designed to enhance thermal conductivity between electronic components and heat sinks, enabling efficient heat dissipation in high-power and high-density devices. X-23-7868 offers excellent thermal performance combined with long-term stability, making it suitable for use in a wide range of electronic, computing, and LED applications.

KEY FEATURES:

High Thermal Conductivity
Formulated to provide effective heat transfer between component surfaces, supporting efficient thermal management in compact designs.

Low Thermal Resistance
Helps minimize thermal resistance at the interface, enabling improved cooling performance for heat-sensitive components.

Stable Performance Over Time
Maintains consistency and thermal properties over extended operating periods, reducing the need for frequent reapplication.

Excellent Workability
Easily applied in thin layers with good wettability and spreadability, ensuring uniform contact between mating surfaces.

Wide Operating Temperature Range
Performs across a typical temperature range of -50°C to +180°C, supporting reliable thermal management under varying environmental and operational conditions.

APPLICATIONS:

• Computer Processors and Graphics Units (CPU/GPU) – Used for improving heat transfer between processors and heat sinks in PCs, servers, and gaming systems.

• Power Electronics – Applied in power modules, inverters, and converters where efficient thermal management is required.

• LED Lighting – Used in LED assemblies to facilitate heat dissipation and maintain light output and longevity.

• Telecommunication Equipment – Supports cooling in high-frequency, high-density electronic systems.

• Automotive Electronics – Suitable for thermal management in electronic control units (ECUs) and battery management systems (BMS).

PACKAGING:

Shin-Etsu X-23-7868 is typically supplied in syringes (e.g., 1g, 5g) or larger containers (e.g., 30g, 100g jars), depending on application needs and distribution region.

INSTRUCTIONS FOR USE:

• Surface Preparation: Ensure surfaces are clean, dry, and free of dust, oil, or oxidation to promote optimal thermal contact.

• Application: Apply a thin, uniform layer of thermal grease using a spatula, screen printing, or automated dispensing equipment.

• Assembly: Assemble components as specified, applying adequate pressure to ensure even distribution and full contact.

SAFETY AND HANDLING:

Shin-Etsu X-23-7868 is generally safe when used as intended. Avoid contact with eyes and prolonged skin exposure. Use in a well-ventilated area and follow appropriate hygiene practices. Refer to the product’s Safety Data Sheet (SDS) for complete safety and handling guidelines.

DISCLAIMER:

The information provided is intended for general reference only. Actual product performance may vary depending on system design, materials used, and operating conditions. Users should consult the official technical datasheet and SDS to confirm product suitability for their specific application.